MK61FN1M0VMJ12 vs MK70FN1M0VMJ12

This detailed comparison of MK61FN1M0VMJ12 and MK70FN1M0VMJ12 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MK61FN1M0VMJ12

NXP Semiconductors

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MK70FN1M0VMJ12

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	256-LBGA	256-LBGA
Description	IC MCU 32BIT 1MB FLSH 256MAPPBGA	IC MCU 32BIT 1MB FLSH 256MAPPBGA
In Stock	1 813	12
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Kinetis K60	Kinetis K70
Package	Tray	Tray
Core Processor	ARM® Cortex®-M4	ARM® Cortex®-M4
Core Size	32-Bit	32-Bit
Speed	120MHz	120MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals	DMA, I²S, LVD, POR, PWM, WDT	DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O	128	128
Program Memory Size	1MB (1M x 8)	1MB (1M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	128K x 8	128K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 77x16b; D/A 2x12b	A/D 71x16b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	256-MAPPBGA (17x17)	256-MAPPBGA (17x17)