MKL17Z256CAL4R vs MKL26Z128CAL4R

This detailed comparison of MKL17Z256CAL4R and MKL26Z128CAL4R in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MKL17Z256CAL4R

NXP Semiconductors

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MKL26Z128CAL4R

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	36-UFBGA, WLCSP	36-UFBGA, WLCSP
Description	IC MCU 32BIT 256KB FLASH 36WLCSP	IC MCU 32BIT 128KB FLASH 36WLCSP
In Stock	2 326	4 964
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Kinetis KL1	Kinetis KL2
Package	Tape & Reel (TR)	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	ARM® Cortex®-M0+	ARM® Cortex®-M0+
Core Size	32-Bit	32-Bit
Speed	48MHz	48MHz
Connectivity	I²C, LINbus, SPI, UART/USART	I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals	Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Number of I/O	26	27
Program Memory Size	256KB (256K x 8)	128KB (128K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	32K x 8	16K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 7x16b; D/A 1x12b	A/D 12bit SAR; D/A 12bit
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	36-WLCSP (2.82x2.67)	36-WLCSP (2.37x2.46)