MSP430F5309IRGCT vs MSP430F5522IRGCR

This detailed comparison of MSP430F5309IRGCT and MSP430F5522IRGCR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MSP430F5309IRGCT

Texas Instruments

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MSP430F5522IRGCR

Texas Instruments

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Specifications Hide identical items

Manufacturer	Texas Instruments	Texas Instruments
Package / Case	64-VFQFN Exposed Pad	64-VFQFN Exposed Pad
Description	IC MCU 16BIT 24KB FLASH 64VQFN	IC MCU 16BIT 32KB FLASH 64VQFN
In Stock	165	951
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	MSP430F5xx	MSP430F5xx
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	CPUXV2	CPUXV2
Core Size	16-Bit	16-Bit
Speed	25MHz	25MHz
Connectivity	I²C, IrDA, LINbus, SCI, SPI, UART/USART	I²C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O	47	47
Program Memory Size	24KB (24K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	6K x 8	10K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 12x10b	A/D 12x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-VQFN (9x9)	64-VQFN (9x9)