P87LPC764BDH,518 vs P87LPC778FDH,529

This detailed comparison of P87LPC764BDH,518 and P87LPC778FDH,529 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

P87LPC764BDH,518

NXP Semiconductors

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P87LPC778FDH,529

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	20-TSSOP (0.173", 4.40mm Width)	20-TSSOP (0.173", 4.40mm Width)
Description	IC MCU 8BIT 4KB OTP 20TSSOP	IC MCU 8BIT 8KB OTP 20TSSOP
In Stock	0	0
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	LPC700	LPC700
Package	Tape & Reel (TR)	Tube
Core Processor	8051	8051
Core Size	8-Bit	8-Bit
Speed	20MHz	20MHz
Connectivity	I²C, UART/USART	I²C, UART/USART
Peripherals	Brown-out Detect/Reset, LED, POR, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	18	18
Program Memory Size	4KB (4K x 8)	8KB (8K x 8)
Program Memory Type	OTP	OTP
EEPROM Size	-	-
RAM Size	128 x 8	128 x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 6V	2.7V ~ 5.5V
Data Converters	-	A/D 4x8b
Oscillator Type	Internal	Internal
Operating Temperature	0°C ~ 70°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	20-TSSOP	20-TSSOP