P87LPC779FDH,529 vs P89LPC9221FDH,518

This detailed comparison of P87LPC779FDH,529 and P89LPC9221FDH,518 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

P87LPC779FDH,529

P87LPC779FDH,529

NXP Semiconductors

P89LPC9221FDH,518

P89LPC9221FDH,518

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 20-TSSOP (0.173", 4.40mm Width) 20-TSSOP (0.173", 4.40mm Width)
Description IC MCU 8BIT 8KB OTP 20TSSOP IC MCU 8BIT 8KB FLASH 20TSSOP
In Stock 0 0
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series LPC700 LPC900
Package Tube Tape & Reel (TR)
Core Processor 8051 8051
Core Size 8-Bit 8-Bit
Speed 20MHz 18MHz
Connectivity I²C, UART/USART I²C, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O 18 18
Program Memory Size 8KB (8K x 8) 8KB (8K x 8)
Program Memory Type OTP FLASH
EEPROM Size - -
RAM Size 128 x 8 256 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.4V ~ 3.6V
Data Converters A/D 4x8b; D/A 2x8b -
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 20-TSSOP 20-TSSOP
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