P89LPC9361FDH,518 vs P89LPC9331FDH,512

This detailed comparison of P89LPC9361FDH,518 and P89LPC9331FDH,512 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

P89LPC9361FDH,518

NXP Semiconductors

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P89LPC9331FDH,512

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	28-TSSOP (0.173", 4.40mm Width)	28-TSSOP (0.173", 4.40mm Width)
Description	IC MCU 8BIT 16KB FLASH 28TSSOP	IC MCU 8BIT 4KB FLASH 28TSSOP
In Stock	0	0
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	LPC900	LPC900
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tube
Core Processor	8051	8051
Core Size	8-Bit	8-Bit
Speed	18MHz	18MHz
Connectivity	I²C, SPI, UART/USART	I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	26	26
Program Memory Size	16KB (16K x 8)	4KB (4K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	512 x 8	-
RAM Size	768 x 8	256 x 8
Voltage - Supply (Vcc/Vdd)	2.4V ~ 3.6V	2.4V ~ 3.6V
Data Converters	A/D 8x8b; D/A 2x8b	A/D 8x8b; D/A 2x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-TSSOP	28-TSSOP