PIC16C55-HSE/SP vs PIC16F73-E/SP

This detailed comparison of PIC16C55-HSE/SP and PIC16F73-E/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC16C55-HSE/SP

Roving Networks / Microchip Technology

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PIC16F73-E/SP

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 8BIT 768B OTP 28SPDIP	IC MCU 8BIT 7KB FLASH 28SPDIP
In Stock	410	183
Mounting Type	Through Hole	Through Hole
Part Status	Obsolete	Active
Series	PIC® 16C	PIC® 16F
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	16MHz	20MHz
Connectivity	-	I²C, SPI, UART/USART
Peripherals	POR, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	20	22
Program Memory Size	768B (512 x 12)	7KB (4K x 14)
Program Memory Type	OTP	FLASH
EEPROM Size	-	-
RAM Size	24 x 8	192 x 8
Voltage - Supply (Vcc/Vdd)	4.5V ~ 5.5V	4V ~ 5.5V
Data Converters	-	A/D 5x8b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP