PIC16C55-LPE/SP vs PIC18F25K50-E/SP | Specification Comparison

PIC16C55-LPE/SP vs PIC18F25K50-E/SP

This detailed comparison of PIC16C55-LPE/SP and PIC18F25K50-E/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC16C55-LPE/SP

Roving Networks / Microchip Technology

PIC18F25K50-E/SP

Roving Networks / Microchip Technology

Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 8BIT 768B OTP 28SPDIP	IC MCU 8BIT 32KB FLASH 28SPDIP
In Stock	177	426
Mounting Type	Through Hole	Through Hole
Part Status	Obsolete	Active
Series	PIC® 16C	PIC® XLP™ 18K
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	40MHz	48MHz
Connectivity	-	I²C, SPI, UART/USART, USB
Peripherals	POR, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	20	22
Program Memory Size	768B (512 x 12)	32KB (16K x 16)
Program Memory Type	OTP	FLASH
EEPROM Size	-	256 x 8
RAM Size	24 x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	2.5V ~ 6V	2.3V ~ 5.5V
Data Converters	-	A/D 14x10b
Oscillator Type	External	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP