PIC16F1709-I/ML vs PIC16F18346T-I/ML

This detailed comparison of PIC16F1709-I/ML and PIC16F18346T-I/ML in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC16F1709-I/ML

Roving Networks / Microchip Technology

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PIC16F18346T-I/ML

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	20-VFQFN Exposed Pad	20-VFQFN Exposed Pad
Description	IC MCU 8BIT 14KB FLASH 20QFN	IC MCU 8BIT 28KB FLASH 20QFN
In Stock	400	252
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	PIC® XLP™ 16F	PIC® XLP™ 16F, Functional Safety (FuSa)
Package	Tube	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	32MHz	32MHz
Connectivity	I²C, LINbus, SPI, UART/USART	I²C, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	18	18
Program Memory Size	14KB (8K x 14)	28KB (16K x 14)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	256 x 8
RAM Size	1K x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	2.3V ~ 5.5V	2.3V ~ 5.5V
Data Converters	A/D 12x10b; D/A 1x8b	A/D 17x10/12b; D/A 1x5b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	20-QFN (4x4)	20-QFN (4x4)