PIC16F18425-I/P vs PIC16F1825-E/P

This detailed comparison of PIC16F18425-I/P and PIC16F1825-E/P in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC16F18425-I/P

PIC16F18425-I/P

Roving Networks / Microchip Technology

PIC16F1825-E/P

PIC16F1825-E/P

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 14-DIP (0.300", 7.62mm) 14-DIP (0.300", 7.62mm)
Description IC MCU 8BIT 14KB FLASH 14DIP IC MCU 8BIT 14KB FLASH 14DIP
In Stock 200 177
Mounting Type Through Hole Through Hole
Part Status Active Active
Series PIC® XLP™ 16F, Functional Safety (FuSa) PIC® XLP™ mTouch™ 16F
Package Tube Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 32MHz 32MHz
Connectivity I²C, LINbus, SPI, UART/USART I²C, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 11 11
Program Memory Size 14KB (8K x 14) 14KB (8K x 14)
Program Memory Type FLASH FLASH
EEPROM Size 256 x 8 256 x 8
RAM Size 1K x 8 1K x 8
Voltage - Supply (Vcc/Vdd) 2.3V ~ 5.5V 1.8V ~ 5.5V
Data Converters A/D 11x12b; D/A 1x5b A/D 8x10b
Oscillator Type External Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 14-PDIP 14-PDIP
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