PIC16F616-H/ML vs PIC16F636T-I/ML

This detailed comparison of PIC16F616-H/ML and PIC16F636T-I/ML in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC16F616-H/ML

PIC16F616-H/ML

Roving Networks / Microchip Technology

PIC16F636T-I/ML

PIC16F636T-I/ML

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 16-VQFN Exposed Pad 16-VQFN Exposed Pad
Description IC MCU 8BIT 3.5KB FLASH 16QFN IC MCU 8BIT 3.5KB FLASH 16QFN
In Stock 216 572
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series Automotive, AEC-Q100, PIC® 16F PIC® 16F
Package Tube Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 20MHz 20MHz
Connectivity - -
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, LVD, POR, WDT
Number of I/O 11 11
Program Memory Size 3.5KB (2K x 14) 3.5KB (2K x 14)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 128 x 8 128 x 8
Voltage - Supply (Vcc/Vdd) 2V ~ 5.5V 2V ~ 5.5V
Data Converters A/D 8x10b -
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 150°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 16-QFN (4x4) 16-QFN (4x4)
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