PIC16LF1458-I/P vs PIC18LF13K22-E/P

This detailed comparison of PIC16LF1458-I/P and PIC18LF13K22-E/P in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC16LF1458-I/P

PIC16LF1458-I/P

Roving Networks / Microchip Technology

PIC18LF13K22-E/P

PIC18LF13K22-E/P

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 20-DIP (0.300", 7.62mm) 20-DIP (0.300", 7.62mm)
Description IC MCU 8BIT 7KB FLASH 20DIP IC MCU 8BIT 8KB FLASH 20DIP
In Stock 318 471
Mounting Type Through Hole Through Hole
Part Status Obsolete Active
Series PIC® XLP™ 16F PIC® XLP™ 18K
Package Tube Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 48MHz 48MHz
Connectivity I²C, LINbus, SPI, UART/USART, USB I²C, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 17 17
Program Memory Size 7KB (4K x 14) 8KB (4K x 16)
Program Memory Type FLASH FLASH
EEPROM Size - 256 x 8
RAM Size 512 x 8 256 x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 9x10b; D/A 1x5b A/D 12x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 20-PDIP 20-PDIP
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