PIC16LF1769-I/ML vs PIC18F14Q40-I/REB

This detailed comparison of PIC16LF1769-I/ML and PIC18F14Q40-I/REB in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC16LF1769-I/ML

PIC16LF1769-I/ML

Roving Networks / Microchip Technology

PIC18F14Q40-I/REB

PIC18F14Q40-I/REB

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 20-VFQFN Exposed Pad 20-VFQFN Exposed Pad
Description IC MCU 8BIT 14KB FLASH 20QFN IC MCU 8BIT 16KB FLASH 512EEPROM
In Stock 677 300
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series PIC® XLP™ 16F PIC® 18F
Package Tube Tray
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 32MHz 64MHz
Connectivity I²C, LINbus, SPI, UART/USART I²C, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 18 18
Program Memory Size 14KB (8K x 14) 16KB (16K x 8)
Program Memory Type FLASH FLASH
EEPROM Size 128 x 8 512 x 8
RAM Size 1K x 8 1K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 5.5V
Data Converters A/D 12x10b; D/A 2x5b, 2x10b A/D 7x12b; D/A 2x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 20-QFN (4x4) 20-VQFN (3x3)
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