PIC18F14Q40-I/REB vs PIC16F1709-E/ML

This detailed comparison of PIC18F14Q40-I/REB and PIC16F1709-E/ML in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18F14Q40-I/REB

Roving Networks / Microchip Technology

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PIC16F1709-E/ML

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	20-VFQFN Exposed Pad	20-VFQFN Exposed Pad
Description	IC MCU 8BIT 16KB FLASH 512EEPROM	IC MCU 8BIT 14KB FLASH 20QFN
In Stock	300	0
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	PIC® 18F	PIC® XLP™ 16F
Package	Tray	Tube
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	64MHz	32MHz
Connectivity	I²C, LINbus, SPI, UART/USART	I²C, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	18	18
Program Memory Size	16KB (16K x 8)	14KB (8K x 14)
Program Memory Type	FLASH	FLASH
EEPROM Size	512 x 8	-
RAM Size	1K x 8	1K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 5.5V	2.3V ~ 5.5V
Data Converters	A/D 7x12b; D/A 2x8b	A/D 12x10b; D/A 1x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	20-VQFN (3x3)	20-QFN (4x4)