PIC18F2331T-I/MM vs PIC16LF1786-E/ML

This detailed comparison of PIC18F2331T-I/MM and PIC16LF1786-E/ML in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18F2331T-I/MM

PIC18F2331T-I/MM

Roving Networks / Microchip Technology

PIC16LF1786-E/ML

PIC16LF1786-E/ML

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-VQFN Exposed Pad 28-VQFN Exposed Pad
Description IC MCU 8BIT 8KB FLASH 28QFN IC MCU 8BIT 14KB FLASH 28QFN
In Stock 850 728
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series PIC® 18F PIC® XLP™ 16F
Package Tape & Reel (TR) Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 40MHz 32MHz
Connectivity I²C, SPI, UART/USART I²C, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT Brown-out Detect/Reset, POR, PSMC, PWM, WDT
Number of I/O 24 24
Program Memory Size 8KB (4K x 16) 14KB (8K x 14)
Program Memory Type FLASH FLASH
EEPROM Size 256 x 8 256 x 8
RAM Size 768 x 8 1K x 8
Voltage - Supply (Vcc/Vdd) 4.2V ~ 5.5V 1.8V ~ 3.6V
Data Converters A/D 5x10b A/D 11x12b; D/A 1x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 28-QFN-S (6x6) 28-QFN (6x6)
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