PIC18F24K50T-I/ML vs PIC18LF26J53T-I/ML

This detailed comparison of PIC18F24K50T-I/ML and PIC18LF26J53T-I/ML in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18F24K50T-I/ML

PIC18F24K50T-I/ML

Roving Networks / Microchip Technology

PIC18LF26J53T-I/ML

PIC18LF26J53T-I/ML

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-VQFN Exposed Pad 28-VQFN Exposed Pad
Description IC MCU 8BIT 16KB FLASH 28QFN IC MCU 8BIT 64KB FLASH 28QFN
In Stock 476 215
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series PIC® XLP™ 18K PIC® XLP™ 18J
Package Tape & Reel (TR) Tape & Reel (TR)
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 48MHz 48MHz
Connectivity I²C, SPI, UART/USART, USB I²C, LINbus, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 22 22
Program Memory Size 16KB (8K x 16) 64KB (32K x 16)
Program Memory Type FLASH FLASH
EEPROM Size 256 x 8 -
RAM Size 2K x 8 3.8K x 8
Voltage - Supply (Vcc/Vdd) 2.3V ~ 5.5V 2V ~ 2.75V
Data Converters A/D 14x10b A/D 10x10b/12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-QFN (6x6) 28-QFN (6x6)
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