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PIC18F26K80-I/SP vs PIC18F24K22-I/SP

This detailed comparison of PIC18F26K80-I/SP and PIC18F24K22-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18F26K80-I/SP

PIC18F26K80-I/SP

Roving Networks / Microchip Technology

PIC18F24K22-I/SP

PIC18F24K22-I/SP

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-DIP (0.300", 7.62mm) 28-DIP (0.300", 7.62mm)
Description IC MCU 8BIT 64KB FLASH 28SPDIP IC MCU 8BIT 16KB FLASH 28SPDIP
In Stock 338 143
Mounting Type Through Hole Through Hole
Part Status Active Active
Series PIC® XLP™ 18K PIC® XLP™ 18K
Package Tube Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 64MHz 64MHz
Connectivity ECANbus, I²C, LINbus, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number of I/O 24 24
Program Memory Size 64KB (32K x 16) 16KB (8K x 16)
Program Memory Type FLASH FLASH
EEPROM Size 1K x 8 256 x 8
RAM Size 3.6K x 8 768 x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V 2.3V ~ 5.5V
Data Converters A/D 8x12b A/D 19x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-SPDIP 28-SPDIP
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