PIC18F45K80-I/P vs PIC16F1719-I/P

This detailed comparison of PIC18F45K80-I/P and PIC16F1719-I/P in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18F45K80-I/P

PIC18F45K80-I/P

Roving Networks / Microchip Technology

PIC16F1719-I/P

PIC16F1719-I/P

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 40-DIP (0.600", 15.24mm) 40-DIP (0.600", 15.24mm)
Description IC MCU 8BIT 32KB FLASH 40DIP IC MCU 8BIT 28KB FLASH 40DIP
In Stock 301 225
Mounting Type Through Hole Through Hole
Part Status Active Active
Series PIC® XLP™ 18K PIC® XLP™ 16F
Package Tube Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 64MHz 32MHz
Connectivity ECANbus, I²C, LINbus, SPI, UART/USART I²C, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 35 35
Program Memory Size 32KB (16K x 16) 28KB (16K x 14)
Program Memory Type FLASH FLASH
EEPROM Size 1K x 8 -
RAM Size 3.6K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V 2.3V ~ 5.5V
Data Converters A/D 11x12b A/D 28x10b; D/A 1x5b, 1x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 40-PDIP 40-PDIP
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