PIC18LF2439-I/SP vs PIC16C745-I/SP

This detailed comparison of PIC18LF2439-I/SP and PIC16C745-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18LF2439-I/SP

Roving Networks / Microchip Technology

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PIC16C745-I/SP

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 8BIT 12KB FLASH 28SPDIP	IC MCU 8BIT 14KB OTP 28SPDIP
In Stock	250	700
Mounting Type	Through Hole	Through Hole
Part Status	Obsolete	Active
Series	PIC® 18F	PIC® 16C
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	40MHz	24MHz
Connectivity	I²C, SPI, UART/USART	SCI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, LVD, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	21	22
Program Memory Size	12KB (6K x 16)	14KB (8K x 14)
Program Memory Type	FLASH	OTP
EEPROM Size	256 x 8	-
RAM Size	640 x 8	256 x 8
Voltage - Supply (Vcc/Vdd)	2V ~ 5.5V	4.35V ~ 5.25V
Data Converters	A/D 5x10b	A/D 5x8b
Oscillator Type	Internal	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP