PIC18LF24K40-I/SP vs PIC18F2423-I/SP

This detailed comparison of PIC18LF24K40-I/SP and PIC18F2423-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18LF24K40-I/SP

PIC18LF24K40-I/SP

Roving Networks / Microchip Technology

PIC18F2423-I/SP

PIC18F2423-I/SP

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-DIP (0.300", 7.62mm) 28-DIP (0.300", 7.62mm)
Description IC MCU 8BIT 16KB FLASH 28SDIP IC MCU 8BIT 16KB FLASH 28SPDIP
In Stock 295 234
Mounting Type Through Hole Through Hole
Part Status Active Active
Series PIC® XLP™ 18K PIC® 18F
Package Tube Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 64MHz 40MHz
Connectivity I²C, LINbus, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number of I/O 25 25
Program Memory Size 16KB (8K x 16) 16KB (8K x 16)
Program Memory Type FLASH FLASH
EEPROM Size 256 x 8 256 x 8
RAM Size 1K x 8 768 x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 4.2V ~ 5.5V
Data Converters A/D 24x10b; D/A 1x5b A/D 10x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-SDIP 28-SPDIP
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