PIC24F32KA302-E/SP vs PIC24F08KM202-E/SP

This detailed comparison of PIC24F32KA302-E/SP and PIC24F08KM202-E/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC24F32KA302-E/SP

Roving Networks / Microchip Technology

Request For Quote

PIC24F08KM202-E/SP

Roving Networks / Microchip Technology

Request For Quote

Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 16BIT 32KB FLASH 28SPDIP	IC MCU 16BIT 8KB FLASH 28SPDIP
In Stock	500	353
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	PIC® XLP™ 24F	PIC® XLP™ 24F
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	16-Bit	16-Bit
Speed	32MHz	32MHz
Connectivity	I²C, IrDA, LINbus, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, HLVD, POR, PWM, WDT	Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O	24	24
Program Memory Size	32KB (11K x 24)	8KB (2.75K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	512 x 8	512 x 8
RAM Size	2K x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 13x12b	A/D 19x10b/12b; D/A 2x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP