PIC24FJ64GA202-E/SP vs PIC24HJ64GP502-E/SP

This detailed comparison of PIC24FJ64GA202-E/SP and PIC24HJ64GP502-E/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC24FJ64GA202-E/SP

Roving Networks / Microchip Technology

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PIC24HJ64GP502-E/SP

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 16BIT 64KB FLASH 28SPDIP	IC MCU 16BIT 64KB FLASH 28SPDIP
In Stock	938	500
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	PIC® XLP™ 24F	Automotive, AEC-Q100, PIC® 24H
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	16-Bit	16-Bit
Speed	32MHz	40 MIPs
Connectivity	I²C, IrDA, LINbus, SmartCard, SPI, UART/USART	CANbus, I²C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals	AES, Brown-out Detect/Reset, DMA, I²S, HLVD, POR, PWM, WDT	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O	21	21
Program Memory Size	64KB (64K x 8)	64KB (22K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	2V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 10x10b/12b	A/D 10x10b/12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP