R5F521A6BDFP#30 vs R5F562GAADFH#V3

This detailed comparison of R5F521A6BDFP#30 and R5F562GAADFH#V3 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F521A6BDFP#30

Renesas Electronics America

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R5F562GAADFH#V3

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	100-LQFP	100-LQFP
Description	IC MCU 32BIT 256KB FLSH 100LFQFP	IC MCU 32BIT 256KB FLASH 112LQFP
In Stock	5 000	3 553
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	RX200	RX600
Package	Tray	Tray
Core Processor	RX	RX
Core Size	32-Bit	32-Bit
Speed	50MHz	100MHz
Connectivity	I²C, IrDA, SCI, SPI	CANbus, I²C, LINbus, SCI, SPI
Peripherals	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT
Number of I/O	66	61
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	8K x 8	-
RAM Size	32K x 8	16K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	4V ~ 5.5V
Data Converters	A/D 7x24b, 7x10b; D/A 2x10b	A/D 12x10b, 8x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-LFQFP (14x14)	112-LQFP (20x20)