R5F572MDHDBD#20 vs R5F572MNDDBD#20

This detailed comparison of R5F572MDHDBD#20 and R5F572MNDDBD#20 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F572MDHDBD#20

Renesas Electronics America

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R5F572MNDDBD#20

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	224-LFBGA	224-LFBGA
Description	IC MCU 32BIT 2MB FLASH 224LFBGA	IC MCU 32BIT 4MB FLASH 224LFBGA
In Stock	5 518	9 000
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	RX72M	RX700
Package	Tray	Tray
Core Processor	RXv3	RXv3
Core Size	32-Bit	32-Bit
Speed	240MHz	240MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals	DMA, LCD, LVD, POR, PWM, WDT	DMA, LCD, LVD, POR, PWM, WDT
Number of I/O	182	182
Program Memory Size	2MB (2M x 8)	4MB (4M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	32K x 8	32K x 8
RAM Size	1M x 8	1M x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 3.6V	2.7V ~ 3.6V
Data Converters	A/D 29x12b; D/A 2x12b	A/D 8x12b, 21x12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	224-LFBGA (13x13)	224-LFBGA (13x13)