R5F572MNHDFC#30 vs R5F566NNDDFC#30

This detailed comparison of R5F572MNHDFC#30 and R5F566NNDDFC#30 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F572MNHDFC#30

Renesas Electronics America

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R5F566NNDDFC#30

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	176-LQFP	176-LQFP
Description	IC MCU 32BIT 4MB FLASH 176LFQFP	IC MCU 32BIT 4MB FLASH 176LFQFP
In Stock	40	40
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	RX72M	RX600
Package	Tray	Tray
Core Processor	RXv3	RXv3
Core Size	32-Bit	32-Bit
Speed	240MHz	120MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals	DMA, LCD, LVD, POR, PWM, WDT	DMA, LCD, LVD, POR, PWM, WDT
Number of I/O	136	136
Program Memory Size	4MB (4M x 8)	4MB (4M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	32K x 8	32K x 8
RAM Size	1M x 8	1M x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 3.6V	2.7V ~ 3.6V
Data Converters	A/D 29x12b; D/A 2x12b	A/D 8x12b, 21x12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	176-LFQFP (24x24)	176-LFQFP (24x24)