S9KEAZN8AVFKR vs ATSAMD10D13A-MNT

This detailed comparison of S9KEAZN8AVFKR and ATSAMD10D13A-MNT in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

S9KEAZN8AVFKR

S9KEAZN8AVFKR

NXP Semiconductors

ATSAMD10D13A-MNT

ATSAMD10D13A-MNT

Roving Networks / Microchip Technology

Specifications
Manufacturer NXP Semiconductors Roving Networks / Microchip Technology
Package / Case 24-VFQFN Exposed Pad 24-VFQFN Exposed Pad
Description IC MCU 32BIT 8KB FLASH 24QFN IC MCU 32BIT 8KB FLASH 24QFN
In Stock 2 949 1 638
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series Kinetis KEA SAM D10D
Package Tape & Reel (TR) Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor ARM® Cortex®-M0+ ARM® Cortex®-M0+
Core Size 32-Bit 32-Bit
Speed 48MHz 48MHz
Connectivity I²C, LINbus, SPI, UART/USART I²C, LINbus, SPI, UART/USART
Peripherals LVD, POR, PWM, WDT Brown-out Detect/Reset, DMA, POR, WDT
Number of I/O 22 22
Program Memory Size 8KB (8K x 8) 8KB (8K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 1K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 1.62V ~ 3.63V
Data Converters A/D 12x12b A/D 10x12b; D/A 1x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 24-QFN (4x4) 24-QFN (4x4)
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