TMPM332FWUG(C) vs ATSAM3N00BA-AUR

This detailed comparison of TMPM332FWUG(C) and ATSAM3N00BA-AUR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

TMPM332FWUG(C)

TMPM332FWUG(C)

Toshiba Electronic Devices and Storage Corporation

ATSAM3N00BA-AUR

ATSAM3N00BA-AUR

Roving Networks / Microchip Technology

Specifications
Manufacturer Toshiba Electronic Devices and Storage Corporation Roving Networks / Microchip Technology
Package / Case 64-LQFP 64-LQFP
Description IC MCU 32BIT 128KB FLASH 64LQFP IC MCU 32BIT 16KB FLASH 64LQFP
In Stock 4 504 1 849
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series TX03 SAM3N
Package Tray Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor ARM® Cortex®-M3 ARM® Cortex®-M3
Core Size 32-Bit 32-Bit
Speed 40MHz 48MHz
Connectivity I²C, SIO, UART/USART I²C, IrDA, SPI, UART/USART
Peripherals POR, WDT Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O 44 47
Program Memory Size 128KB (128K x 8) 16KB (16K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 8K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V 1.62V ~ 3.6V
Data Converters A/D 8x10b A/D 10x10b; D/A 1x10b
Oscillator Type External Internal
Operating Temperature -20°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 64-LQFP (10x10) 64-LQFP (10x10)
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