UPD70F3610M2GAA-GAN-E2-QS-AX vs UPD70F3805GB(R)-GAH-AX

This detailed comparison of UPD70F3610M2GAA-GAN-E2-QS-AX and UPD70F3805GB(R)-GAH-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3610M2GAA-GAN-E2-QS-AX

Renesas Electronics America

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UPD70F3805GB(R)-GAH-AX

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	64-LQFP	64-LQFP
Description	IC MCU 32BIT 64KB FLASH 64LQFP	IC MCU 32BIT 16KB FLASH 64LQFP
In Stock	1 980	2 500
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Obsolete
Series	V850ES/Fx3-L	V850ES/Jx3-L
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tray
Core Processor	V850ES	V850ES
Core Size	32-Bit	32-Bit
Speed	20MHz	20MHz
Connectivity	CANbus, CSI, I²C, UART/USART	CSI, EBI/EMI, I²C, UART/USART
Peripherals	LVD, PWM, WDT	DMA, LVD, PWM, WDT
Number of I/O	51	50
Program Memory Size	64KB (64K x 8)	16KB (16K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	6K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	3.3V ~ 5.5V	2.2V ~ 3.6V
Data Converters	A/D 10x10b	A/D 10x10b; D/A 1x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C (TA)
Supplier Device Package	64-LQFP (7x7)	-