UPD70F3714GC-8BS-A vs UPD70F3806GB(R)-GAH-AX

This detailed comparison of UPD70F3714GC-8BS-A and UPD70F3806GB(R)-GAH-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3714GC-8BS-A

UPD70F3714GC-8BS-A

Renesas Electronics America

UPD70F3806GB(R)-GAH-AX

UPD70F3806GB(R)-GAH-AX

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 64-LQFP 64-LQFP
Description IC MCU 32BIT 128KB FLASH 64LQFP IC MCU 32BIT 32KB FLASH 64LQFP
In Stock 3 511 7 434
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series V850ES/Ix2 V850ES/Jx3-L
Package Tray Tray
Core Processor V850ES V850ES
Core Size 32-Bit 32-Bit
Speed 20MHz 20MHz
Connectivity CSI, UART/USART CSI, EBI/EMI, I²C, UART/USART
Peripherals LVD, PWM, WDT DMA, LVD, PWM, WDT
Number of I/O 39 50
Program Memory Size 128KB (128K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 6K x 8 8K x 8
Voltage - Supply (Vcc/Vdd) 3.5V ~ 5.5V 2.2V ~ 3.6V
Data Converters A/D 8x10b A/D 10x10b; D/A 1x8b
Oscillator Type External Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package - -
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