UPD70F3736GK-GAK-AX vs UPD70F3736GC-GAD-AX

This detailed comparison of UPD70F3736GK-GAK-AX and UPD70F3736GC-GAD-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3736GK-GAK-AX

UPD70F3736GK-GAK-AX

Renesas Electronics America

UPD70F3736GC-GAD-AX

UPD70F3736GC-GAD-AX

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 80-LQFP 80-LQFP
Description IC MCU 32BIT 256KB FLASH 80LQFP IC MCU 32BIT 256KB FLASH 80LQFP
In Stock 4 300 2 874
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series V850ES/Jx3-L V850ES/Jx3-L
Package Tray Tray
Core Processor V850ES V850ES
Core Size 32-Bit 32-Bit
Speed 20MHz 20MHz
Connectivity CSI, EBI/EMI, I²C, UART/USART CSI, EBI/EMI, I²C, UART/USART
Peripherals DMA, LVD, PWM, WDT DMA, LVD, PWM, WDT
Number of I/O 66 66
Program Memory Size 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 16K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V 2.2V ~ 3.6V
Data Converters A/D 8x10b; D/A 1x8b A/D 8x10b; D/A 1x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package - -
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