UPD70F3806GB(R)-GAH-AX vs UPD70F3610M2GAA-GAN-E2-QS-AX

This detailed comparison of UPD70F3806GB(R)-GAH-AX and UPD70F3610M2GAA-GAN-E2-QS-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3806GB(R)-GAH-AX

Renesas Electronics America

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UPD70F3610M2GAA-GAN-E2-QS-AX

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	64-LQFP	64-LQFP
Description	IC MCU 32BIT 32KB FLASH 64LQFP	IC MCU 32BIT 64KB FLASH 64LQFP
In Stock	7 434	1 980
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	V850ES/Jx3-L	V850ES/Fx3-L
Package	Tray	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	V850ES	V850ES
Core Size	32-Bit	32-Bit
Speed	20MHz	20MHz
Connectivity	CSI, EBI/EMI, I²C, UART/USART	CANbus, CSI, I²C, UART/USART
Peripherals	DMA, LVD, PWM, WDT	LVD, PWM, WDT
Number of I/O	50	51
Program Memory Size	32KB (32K x 8)	64KB (64K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	6K x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 3.6V	3.3V ~ 5.5V
Data Converters	A/D 10x10b; D/A 1x8b	A/D 10x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C
Supplier Device Package	-	64-LQFP (7x7)