UPD70F3814GA(R)-GAM-AX vs UPD70F3815GA-GAM-AX

This detailed comparison of UPD70F3814GA(R)-GAM-AX and UPD70F3815GA-GAM-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3814GA(R)-GAM-AX

Renesas Electronics America

Request For Quote

UPD70F3815GA-GAM-AX

Renesas Electronics America

Request For Quote

Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	48-LQFP	48-LQFP
Description	IC MCU 32BIT 16KB FLASH 48LQFP	IC MCU 32BIT 32KB FLASH 48LQFP
In Stock	2 500	2 089
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	V850ES/Jx3-H	V850ES/Jx3-H
Package	Tray	Tray
Core Processor	V850ES	V850ES
Core Size	32-Bit	32-Bit
Speed	48MHz	48MHz
Connectivity	CANbus, CSI, EBI/EMI, I²C, UART/USART, USB	CANbus, CSI, EBI/EMI, I²C, UART/USART, USB
Peripherals	DMA, LVD, PWM, WDT	DMA, LVD, PWM, WDT
Number of I/O	32	32
Program Memory Size	16KB (16K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	16K x 8
Voltage - Supply (Vcc/Vdd)	2.85V ~ 3.6V	2.85V ~ 3.6V
Data Converters	A/D 6x10b; D/A 1x8b	A/D 6x10b; D/A 1x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	-	-