XC226796F66LACKXUMA1 vs XC2267M104F80LAAKXUMA1

This detailed comparison of XC226796F66LACKXUMA1 and XC2267M104F80LAAKXUMA1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XC226796F66LACKXUMA1

XC226796F66LACKXUMA1

VIGOR

XC2267M104F80LAAKXUMA1

XC2267M104F80LAAKXUMA1

VIGOR

Specifications
Manufacturer VIGOR VIGOR
Package / Case 100-LQFP Exposed Pad 100-LQFP Exposed Pad
Description IC MCU 16/32B 768KB FLSH 100LQFP 16 BIT C166 MICROXC2200 FAMILY (
In Stock 681 852
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series XC22xx XC22xxM
Package Bulk Bulk
Core Processor C166SV2 C166SV2
Core Size 16/32-Bit 16/32-Bit
Speed 66MHz 80MHz
Connectivity CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals DMA, I²S, POR, PWM, WDT I²S, POR, PWM, WDT
Number of I/O 75 75
Program Memory Size 768KB (768K x 8) 832KB (832K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 82K x 8 50K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 16x8/10b A/D 16x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package PG-LQFP-100-3 PG-LQFP-100-8
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