XMC1302Q024F0032ABXUMA1 vs LPC1114LVFHN24/103

This detailed comparison of XMC1302Q024F0032ABXUMA1 and LPC1114LVFHN24/103 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XMC1302Q024F0032ABXUMA1

XMC1302Q024F0032ABXUMA1

IR (Infineon Technologies)

LPC1114LVFHN24/103

LPC1114LVFHN24/103

NXP Semiconductors

Specifications
Manufacturer IR (Infineon Technologies) NXP Semiconductors
Package / Case 24-VFQFN Exposed Pad 24-VFQFN Exposed Pad
Description IC MCU 32BIT 32KB FLASH 24VQFN IC MCU 32BIT 32KB FLASH 24HVQFN
In Stock 7 500 1 158
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series XMC1000 LPC1100LV
Package Tape & Reel (TR) Tray
Core Processor ARM® Cortex®-M0 ARM® Cortex®-M0
Core Size 32-Bit 32-Bit
Speed 32MHz 50MHz
Connectivity I²C, LINbus, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, I²S, POR, PWM, WDT Brown-out Detect/Reset, POR, WDT
Number of I/O 18 20
Program Memory Size 32KB (32K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 16K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V 1.65V ~ 1.95V
Data Converters A/D 13x12b A/D 8x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package PG-VQFN-24-19 24-HVQFN (4x4)
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