ZGP323LAP2008C vs ZLP32300P2016G

This detailed comparison of ZGP323LAP2008C and ZLP32300P2016G in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ZGP323LAP2008C

Zilog / Littelfuse

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ZLP32300P2016G

Maxim Integrated

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Specifications Hide identical items

Manufacturer	Zilog / Littelfuse	Maxim Integrated
Package / Case	20-DIP (0.300", 7.62mm)	20-DIP (0.300", 7.62mm)
Description	IC MCU 8BIT 8KB OTP 20DIP	IC MCU 8BIT 16KB OTP 20DIP
In Stock	1 120	3 278
Mounting Type	Through Hole	Through Hole
Part Status	Obsolete	Obsolete
Series	Z8® GP™	Crimzon™ ZLP
Package	Tube	Tube
Core Processor	Z8	Z8
Core Size	8-Bit	8-Bit
Speed	8MHz	8MHz
Connectivity	-	-
Peripherals	HLVD, POR, WDT	Brown-out Detect/Reset, HLVD, POR, WDT
Number of I/O	16	16
Program Memory Size	8KB (8K x 8)	16KB (16K x 8)
Program Memory Type	OTP	OTP
EEPROM Size	-	-
RAM Size	237 x 8	237 x 8
Voltage - Supply (Vcc/Vdd)	2V ~ 3.6V	2V ~ 3.6V
Data Converters	-	-
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	0°C ~ 70°C (TA)
Supplier Device Package	-	20-PDIP