
| Type | Description |
|---|---|
| Series: | 714 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.1" (2.54mm) Row Spacing |
| Number of Positions or Pins (Grid): | 58 (2 x 29) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Carrier, Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 10 | ||
| 25 | ||
| 50 | ||
| 100 | ||
| 250 | ||
| 500 |
Current price of 714-43-258-31-018000 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 28POS GOLD
CONN IC DIP SOCKET 22POS GOLD
CONN IC DIP SOCKET 52POS GOLD
CRYSTAL 60.0000MHZ 8PF SMD
MEMS OSC XO 66.6666MHZ LVCMOS LV
SOLDER PASTE NO CLEAN LEAD-FREE
CONN IC DIP SOCKET 58POS GOLD