
| Type | Description |
|---|---|
| Series: | 117 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.4" (10.16mm) Row Spacing |
| Number of Positions or Pins (Grid): | 48 (2 x 24) |
| Pitch - Mating: | 0.070" (1.78mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.070" (1.78mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1 | ||
| 168 |
Current price of 117-83-448-41-005101 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 22POS GOLD
CONN IC DIP SOCKET 36POS GOLD
CONN IC DIP SOCKET 18POS GOLD
FIXED IND 3.9UH 7.5A 12.5 MOHM
XTAL OSC VCXO 222.527472MHZ LVDS
MEMS OSC XO 24.5760MHZ LVCMOS LV
CONN IC DIP SOCKET 48POS GOLD