ATSAM3SD8BA-MU vs ATSAM3S4BA-MUR

This detailed comparison of ATSAM3SD8BA-MU and ATSAM3S4BA-MUR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3SD8BA-MU

Roving Networks / Microchip Technology

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ATSAM3S4BA-MUR

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	64-VFQFN Exposed Pad	64-VFQFN Exposed Pad
Description	IC MCU 32BIT 512KB FLASH 64QFN	IC MCU 32BIT 256KB FLASH 64QFN
In Stock	251	395
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM3S	SAM3S
Package	Tray	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	64MHz	64MHz
Connectivity	I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB	I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	47	47
Program Memory Size	512KB (512K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	64K x 8	48K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	1.62V ~ 3.6V
Data Converters	A/D 10x10/12b; D/A 2x12b	A/D 10x10/12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-QFN (9x9)	64-QFN (9x9)