ATSAM3SD8BA-MU vs CY9BF321LQN-G-AVE2

This detailed comparison of ATSAM3SD8BA-MU and CY9BF321LQN-G-AVE2 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3SD8BA-MU

Roving Networks / Microchip Technology

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CY9BF321LQN-G-AVE2

Cypress Semiconductor

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Cypress Semiconductor
Package / Case	64-VFQFN Exposed Pad	64-VFQFN Exposed Pad
Description	IC MCU 32BIT 512KB FLASH 64QFN	IC MCU 32BIT 96KB FLASH 64QFN
In Stock	251	1 690
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM3S	FM3 MB9B320M
Package	Tray	Tray
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	64MHz	72MHz
Connectivity	I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB	CSIO, EBI/EMI, I²C, LINbus, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT
Number of I/O	47	50
Program Memory Size	512KB (512K x 8)	96KB (96K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	64K x 8	16K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	2.7V ~ 5.5V
Data Converters	A/D 10x10/12b; D/A 2x12b	A/D 23x12b; D/A 2x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	64-QFN (9x9)	64-QFN (9x9)