ATSAME70Q19B-CN vs ATSAMS70Q19B-CFN

This detailed comparison of ATSAME70Q19B-CN and ATSAMS70Q19B-CFN in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAME70Q19B-CN

Roving Networks / Microchip Technology

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ATSAMS70Q19B-CFN

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	144-FBGA	144-FBGA
Description	IC MCU 32BIT 512KB FLSH 144LFBGA	IC MCU 32BIT 512KB FLSH 144LFBGA
In Stock	480	490
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM E70	SAM S70
Package	Tray	Tray
Core Processor	ARM® Cortex®-M7	ARM® Cortex®-M7
Core Size	32-Bit	32-Bit
Speed	300MHz	300MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB	EBI/EMI, I²C, IrDA, LINbus, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	114	114
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	256K x 8	256K x 8
Voltage - Supply (Vcc/Vdd)	1.7V ~ 3.6V	1.7V ~ 3.6V
Data Converters	A/D 24x12b; D/A 2x12b	A/D 24x12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	144-LFBGA (10x10)	144-LFBGA (10x10)