D13008FBL25V vs DF3062BFI25QV

This detailed comparison of D13008FBL25V and DF3062BFI25QV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

D13008FBL25V

Renesas Electronics America

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DF3062BFI25QV

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	100-BFQFP	100-BFQFP
Description	IC MCU 16BIT ROMLESS 100QFP	IC MCU 16BIT 128KB FLASH 100QFP
In Stock	2 000	154
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	H8® H8/300H	H8® H8/300H
Package	Tray	Tray
Core Processor	H8/300H	H8/300H
Core Size	16-Bit	16-Bit
Speed	25MHz	25MHz
Connectivity	SCI, SmartCard	SCI, SmartCard
Peripherals	PWM, WDT	DMA, POR, PWM, WDT
Number of I/O	35	70
Program Memory Size	-	128KB (128K x 8)
Program Memory Type	ROMless	FLASH
EEPROM Size	-	-
RAM Size	4K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	4.5V ~ 5.5V	4.5V ~ 5.5V
Data Converters	A/D 8x10b; D/A 2x8b	A/D 8x10b; D/A 2x8b
Oscillator Type	Internal	Internal
Operating Temperature	-20°C ~ 75°C (TA)	-20°C ~ 75°C (TA)
Supplier Device Package	100-QFP (14x14)	100-QFP (14x14)