DF36037GFPJV vs HD64F3687GFPIV

This detailed comparison of DF36037GFPJV and HD64F3687GFPIV in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DF36037GFPJV

DF36037GFPJV

Renesas Electronics America

HD64F3687GFPIV

HD64F3687GFPIV

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 64-LQFP 64-LQFP
Description IC MCU 16BIT 56KB FLASH 64LFQFP IC MCU 16BIT 56KB FLASH 64LQFP
In Stock 315 677
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series H8® H8/300H Tiny H8® H8/300H Tiny
Package Tray Tray
Core Processor H8/300H H8/300H
Core Size 16-Bit 16-Bit
Speed 20MHz 20MHz
Connectivity CANbus, SCI, SSU I²C, SCI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 45 45
Program Memory Size 56KB (56K x 8) 56KB (56K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 3K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 64-LFQFP (10x10) 64-LQFP (10x10)
Part Number Manufacturer Description Request For Quote
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