DSPIC33FJ06GS001-E/P vs DSPIC33FJ06GS001-I/P

This detailed comparison of DSPIC33FJ06GS001-E/P and DSPIC33FJ06GS001-I/P in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

DSPIC33FJ06GS001-E/P

DSPIC33FJ06GS001-E/P

Roving Networks / Microchip Technology

DSPIC33FJ06GS001-I/P

DSPIC33FJ06GS001-I/P

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 18-DIP (0.300", 7.62mm) 18-DIP (0.300", 7.62mm)
Description IC MCU 16BIT 6KB FLASH 18DIP IC MCU 16BIT 6KB FLASH 18DIP
In Stock 221 460
Mounting Type Through Hole Through Hole
Part Status Active Active
Series Automotive, AEC-Q100, dsPIC™ 33F dsPIC™ 33F
Package Tube Tube
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed 40 MIPs 40 MIPs
Connectivity I²C, IrDA, LINbus, SPI, UART/USART I²C, IrDA, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 13 13
Program Memory Size 6KB (2K x 24) 6KB (2K x 24)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 256 x 8 256 x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 6x10b A/D 6x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 18-PDIP 18-PDIP
Part Number Manufacturer Description Request For Quote
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