MINI55TDE vs MINI57TDE

This detailed comparison of MINI55TDE and MINI57TDE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MINI55TDE

Nuvoton Technology Corporation America

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MINI57TDE

Nuvoton Technology Corporation America

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Specifications Hide identical items

Manufacturer	Nuvoton Technology Corporation America	Nuvoton Technology Corporation America
Package / Case	32-WFQFN Exposed Pad	32-WFQFN Exposed Pad
Description	IC MCU 32BIT 17.5KB FLASH 33QFN	IC MCU 32BIT 29.5KB FLASH 33QFN
In Stock	6 664	3 550
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	NuMicro Mini55™	NuMicro Mini57™
Package	Tray	Tube
Core Processor	ARM® Cortex®-M0	ARM® Cortex®-M0
Core Size	32-Bit	32-Bit
Speed	48MHz	48MHz
Connectivity	I²C, SPI, UART/USART	I²C, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, LVR, POR, PWM, WDT	Brown-out Detect/Reset, I²S, POR, PWM, WDT
Number of I/O	29	22
Program Memory Size	17.5KB (17.5K x 8)	29.5KB (29.5k x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	2K x 8	4K x 8
Voltage - Supply (Vcc/Vdd)	2.1V ~ 5.5V	2.1V ~ 5.5V
Data Converters	A/D 12x10b	A/D 8x12b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	33-QFN (4x4)	33-QFN (4x4)