MINI55TDE vs MINI58TDE

This detailed comparison of MINI55TDE and MINI58TDE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MINI55TDE

MINI55TDE

Nuvoton Technology Corporation America

MINI58TDE

MINI58TDE

Nuvoton Technology Corporation America

Specifications
Manufacturer Nuvoton Technology Corporation America Nuvoton Technology Corporation America
Package / Case 32-WFQFN Exposed Pad 32-WFQFN Exposed Pad
Description IC MCU 32BIT 17.5KB FLASH 33QFN IC MCU 32BIT 32KB FLASH 33QFN
In Stock 6 664 1 226
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series NuMicro Mini55™ NuMicro Mini58™ DE
Package Tray Tray
Core Processor ARM® Cortex®-M0 ARM® Cortex®-M0
Core Size 32-Bit 32-Bit
Speed 48MHz 50MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LVR, POR, PWM, WDT Brown-out Detect/Reset, PWM, WDT
Number of I/O 29 29
Program Memory Size 17.5KB (17.5K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 2K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 2.1V ~ 5.5V 2.5V ~ 5.5V
Data Converters A/D 12x10b A/D 8x10b
Oscillator Type External Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 33-QFN (4x4) 33-QFN (4x4)
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