PIC18LF23K22-I/SP vs PIC18LF25K22-I/SP

This detailed comparison of PIC18LF23K22-I/SP and PIC18LF25K22-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18LF23K22-I/SP

PIC18LF23K22-I/SP

Roving Networks / Microchip Technology

PIC18LF25K22-I/SP

PIC18LF25K22-I/SP

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-DIP (0.300", 7.62mm) 28-DIP (0.300", 7.62mm)
Description IC MCU 8BIT 8KB FLASH 28SPDIP IC MCU 8BIT 32KB FLASH 28SPDIP
In Stock 893 0
Mounting Type Through Hole Through Hole
Part Status Active Active
Series PIC® XLP™ 18K PIC® XLP™ 18K
Package Tube Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 64MHz 64MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, HLVD, POR, PWM, WDT Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number of I/O 24 24
Program Memory Size 8KB (4K x 16) 32KB (16K x 16)
Program Memory Type FLASH FLASH
EEPROM Size 256 x 8 256 x 8
RAM Size 512 x 8 1.5K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 19x10b A/D 19x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-SPDIP 28-SPDIP
Part Number Manufacturer Description Request For Quote
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