R5F572TFADFP#30 vs R5F566TEEDFP#30

This detailed comparison of R5F572TFADFP#30 and R5F566TEEDFP#30 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F572TFADFP#30

Renesas Electronics America

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R5F566TEEDFP#30

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	100-LQFP	100-LQFP
Description	IC MCU 32BIT 512KB FLSH 100LFQFP	IC MCU 32BIT 512KB FLSH 100LFQFP
In Stock	65	90
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	RX72T	RX66T
Package	Tray	Tray
Core Processor	RXv3	RXv3
Core Size	32-Bit	32-Bit
Speed	200MHz	160MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD, QSPI, SCI, SPI, SSI	CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART
Peripherals	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT
Number of I/O	72	72
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	32K x 8	32K x 8
RAM Size	128K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	2.7V ~ 5.5V
Data Converters	A/D 24x12b; D/A 2x12b	A/D 22x12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-LFQFP (14x14)	100-LFQFP (14x14)