R7F7010113AFP#BA4 vs R7F7010163AFP#BA4

This detailed comparison of R7F7010113AFP#BA4 and R7F7010163AFP#BA4 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R7F7010113AFP#BA4

Renesas Electronics America

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R7F7010163AFP#BA4

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	-	-
Description	IC MCU 32BIT 256KB FLASH	IC MCU 32BIT 256KB FLASH
In Stock	3 908	1 500
Mounting Type	-	-
Part Status	Active	Active
Series	RH850/F1x	RH850/F1x
Package	Tray	Tray
Core Processor	RH850G3K	RH850G3K
Core Size	32-Bit	32-Bit
Speed	80MHz	80MHz
Connectivity	CANbus, CSI, I²C, LINbus, SPI, UART/USART	CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals	DMA, PWM, WDT	DMA, PWM, WDT
Number of I/O	49	65
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	32K x 8	32K x 8
RAM Size	32K x 8	32K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 11x10b, 10x12b	A/D 14x10b, 11x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	-	-