TMPM332FWUG(C) vs ATSAM3S2BA-AUR

This detailed comparison of TMPM332FWUG(C) and ATSAM3S2BA-AUR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

TMPM332FWUG(C)

Toshiba Electronic Devices and Storage Corporation

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ATSAM3S2BA-AUR

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Toshiba Electronic Devices and Storage Corporation	Roving Networks / Microchip Technology
Package / Case	64-LQFP	64-LQFP
Description	IC MCU 32BIT 128KB FLASH 64LQFP	IC MCU 32BIT 128KB FLASH 64LQFP
In Stock	4 504	1 490
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	TX03	SAM3S
Package	Tray	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	40MHz	64MHz
Connectivity	I²C, SIO, UART/USART	I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals	POR, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	44	47
Program Memory Size	128KB (128K x 8)	128KB (128K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	32K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 3.6V	1.62V ~ 3.6V
Data Converters	A/D 8x10b	A/D 10x10/12b; D/A 2x12b
Oscillator Type	External	Internal
Operating Temperature	-20°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-LQFP (10x10)	64-LQFP (10x10)