UPD70F3736GC-GAD-AX vs UPD70F3736GK-GAK-AX

This detailed comparison of UPD70F3736GC-GAD-AX and UPD70F3736GK-GAK-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3736GC-GAD-AX

Renesas Electronics America

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UPD70F3736GK-GAK-AX

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	80-LQFP	80-LQFP
Description	IC MCU 32BIT 256KB FLASH 80LQFP	IC MCU 32BIT 256KB FLASH 80LQFP
In Stock	2 874	4 300
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	V850ES/Jx3-L	V850ES/Jx3-L
Package	Tray	Tray
Core Processor	V850ES	V850ES
Core Size	32-Bit	32-Bit
Speed	20MHz	20MHz
Connectivity	CSI, EBI/EMI, I²C, UART/USART	CSI, EBI/EMI, I²C, UART/USART
Peripherals	DMA, LVD, PWM, WDT	DMA, LVD, PWM, WDT
Number of I/O	66	66
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	16K x 8	16K x 8
Voltage - Supply (Vcc/Vdd)	2.2V ~ 3.6V	2.2V ~ 3.6V
Data Converters	A/D 8x10b; D/A 1x8b	A/D 8x10b; D/A 1x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	-	-